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70V3319S133PRFGI - Renesas Electronics

Description: The 70V3319 is a high-speed 256K x 18 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3319 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 3.3V.

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70V3319S133PRFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - pkg128
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70V3319S133PRFGI Details

  • Manufacturer Part Number:

    70V3319S133PRFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TQFP

  • Pin Count:

    128

  • Manufacturer Package Code:

    PKG128

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    128

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP128,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.04 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

70V3319S133PRFGI Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for the 70V3319S133PRFGI, which includes recommended PCB layout and thermal management guidelines. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • Renesas recommends using a power management IC (PMIC) specifically designed for the 70V3319S133PRFGI. The PMIC should be able to provide the required voltage rails, power sequencing, and voltage regulation. Renesas provides a list of recommended PMICs and application notes for power sequencing and voltage regulation.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1uF to 1uF, placed as close as possible to the power pins of the 70V3319S133PRFGI. The capacitors should be rated for the maximum operating voltage and have a low inductance to minimize noise and voltage droop.
  • Renesas recommends following the guidelines for signal integrity and noise reduction provided in the application notes and reference design guides. This includes using differential signaling, impedance matching, and proper termination, as well as minimizing trace lengths and using shielding and grounding techniques to reduce electromagnetic interference (EMI).
  • Renesas recommends using a high-quality clock source with a low jitter and phase noise. The clock signal should be generated using a crystal oscillator or a phase-locked loop (PLL) and distributed using a clock distribution network with minimal skew and jitter. Renesas provides guidelines for clock signal generation and distribution in the application notes and reference design guides.

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70V3319S133PRFGI Overview

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