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7130LA25TFGI - Renesas Electronics

Description: The 7130 is a high-speed 1K x 8 Dual-Port Static RAM designed to be used as a stand-alone 8-bit Dual-Port RAM or as a "MASTER" Dual-Port RAM together with the 7140 "SLAVE" Dual-Port in 16-bit-or-more word width systems which would result in full-speed, error free operation without the need for additional discrete logic. An automatic power down feature, controlled by CE, permits the on chip circuitry of each port to enter a very low standby power mode. Military grade product in compliance with MIL-PRF-38535

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7130LA25TFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PPG64_
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7130LA25TFGI Details

  • Manufacturer Part Number:

    7130LA25TFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PPG64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    25 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Memory Density:

    8192 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    64

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.004 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.22 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

7130LA25TFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-113) which includes thermal vias, thermal pads, and heat sink recommendations to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a fuse or a current sense resistor, to detect overcurrent conditions. The device also has a built-in overcurrent protection feature that can be enabled through the OCP pin.
  • The maximum junction temperature (Tj) for the 7130LA25TFGI is 150°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • Yes, the 7130LA25TFGI is designed to operate in high-vibration environments. However, it's essential to follow Renesas' guidelines for vibration testing and to ensure proper PCB mounting and mechanical design to minimize the risk of mechanical failure.
  • Renesas provides a troubleshooting guide in their application note (APL-AN-114) that covers common issues, such as output voltage errors, overcurrent conditions, and thermal shutdown. Additionally, engineers can use Renesas' development tools, such as the Renesas Starter Kit, to debug and troubleshoot their designs.

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7130LA25TFGI Overview

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