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71T75902S75PFGI - Renesas Electronics

Description: The 71T75902 2.5V CMOS Synchronous SRAM organized as 1M x 18 (18 Megabit). It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus it has been given the name ZBTTM, or Zero Bus Turnaround.

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71T75902S75PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100-
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71T75902S75PFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100-
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71T75902S75PFGI Details

  • Manufacturer Part Number:

    71T75902S75PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Access Time-Max:

    75 ns

  • Clock Frequency-Max (fCLK):

    100 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    100

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX18

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.06 A

  • Standby Voltage-Min:

    2.375 V

  • Supply Current-Max:

    0.295 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71T75902S75PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP-AN-1143) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends a specific power sequencing scheme in their application note (AP-AN-1143) to ensure proper device operation. The sequence involves powering up the VCC, then the VDD, and finally the VTT.
  • Renesas recommends using high-frequency, low-ESR capacitors (e.g., 0402 or 0603 packages) with a value of 0.1 μF to 1 μF, placed as close as possible to the device's power pins.
  • The thermal shutdown feature is enabled by default. When the device exceeds the thermal threshold (typically 150°C), it will shut down. To handle this, implement a thermal monitoring system, such as a thermistor or thermal diode, to detect overheating and take corrective action.
  • The recommended operating frequency range for the 71T75902S75PFGI is 100 kHz to 1 MHz, although it can operate up to 2 MHz with reduced performance. Consult the datasheet for specific frequency-dependent characteristics.

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