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71T75902S75PFGI8 - Renesas Electronics

Description: The 71T75902 2.5V CMOS Synchronous SRAM organized as 1M x 18 (18 Megabit). It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus it has been given the name ZBTTM, or Zero Bus Turnaround.

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71T75902S75PFGI8 - Renesas Electronics - PCB symbol
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PCB Footprints
71T75902S75PFGI8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100-
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71T75902S75PFGI8 - Renesas Electronics - 3D model - Quad Flat Packages - PKG100-
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71T75902S75PFGI8 Details

  • Manufacturer Part Number:

    71T75902S75PFGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Access Time-Max:

    75 ns

  • Clock Frequency-Max (fCLK):

    100 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    100

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX18

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.06 A

  • Standby Voltage-Min:

    2.375 V

  • Supply Current-Max:

    0.295 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71T75902S75PFGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for the 71T75902S75PFGI8, which includes recommendations for PCB layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance, reduce noise, and prevent thermal issues.
  • The 71T75902S75PFGI8 requires a specific power sequencing and voltage regulation scheme. Renesas recommends using a dedicated power management IC (PMIC) or a custom power supply design that meets the device's power requirements. Consult the datasheet and application notes for more information.
  • To minimize EMI and ensure EMC, follow Renesas' guidelines for PCB layout, component placement, and shielding. Additionally, use EMI filters, ferrite beads, and other noise-reducing components as necessary. Consult the datasheet and relevant application notes for more information.
  • Renesas provides a range of debugging tools and software, including the Renesas Flash Development Toolkit and the Renesas Debug Interface. These tools allow you to debug and troubleshoot issues with the device. Additionally, consult the datasheet, application notes, and online forums for troubleshooting guidance.
  • The 71T75902S75PFGI8 is designed to operate within specific environmental and operating conditions, including temperature, humidity, and voltage ranges. Consult the datasheet for detailed information on the device's operating conditions and ensure that your design meets these requirements.

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