71V30S55TFG8 - Renesas Electronics

71V30S55TFG8 Details

• Manufacturer Part Number:

  71V30S55TFG8

• Brand Name:

  Renesas

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  TQFP

• Pin Count:

  64

• Manufacturer Package Code:

  PPG64

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Renesas Electronics Corporation

• YTEOL:

  0

• Access Time-Max:

  55 ns

• I/O Type:

  COMMON

• JESD-30 Code:

  S-PQFP-F64

• JESD-609 Code:

  e3

• Length:

  10 mm

• Memory Density:

  8192 bit

• Memory IC Type:

  MULTI-PORT SRAM

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Ports:

  2

• Number of Terminals:

  64

• Number of Words:

  1024 words

• Number of Words Code:

  1000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  1KX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  QFF

• Package Equivalence Code:

  QFP64,.47SQ,20

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.6 mm

• Standby Current-Max:

  0.005 A

• Standby Voltage-Min:

  3 V

• Supply Current-Max:

  0.135 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  3 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  MATTE TIN

• Terminal Form:

  FLAT

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  10 mm