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72V265LA10TFG - Renesas Electronics

Description: The 72V265 is an 16K x 18 SuperSync FIFO memory with clocked read and write controls. It's a functionally compatible version of the 72265 designed to run off a 3.3V supply for very low power consumption. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that ne

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72V265LA10TFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PPG64_-_
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72V265LA10TFG Details

  • Manufacturer Part Number:

    72V265LA10TFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PPG64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    6.5 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Cycle Time:

    10 ns

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Memory Density:

    294912 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    16KX18

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.02 A

  • Supply Current-Max:

    0.055 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

72V265LA10TFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable heat sink, and implement thermal monitoring and protection mechanisms, such as thermal shutdown or warning signals.
  • The datasheet provides general guidelines for input and output capacitors, but Renesas recommends using capacitors with specific characteristics, such as low ESR, high ripple current, and suitable voltage ratings, to ensure stable operation and minimize noise.
  • Renesas provides a troubleshooting guide in their application notes, which includes steps for identifying and resolving common issues, such as voltage regulator faults, thermal shutdown, and output voltage deviations.
  • In high-reliability or safety-critical applications, it's essential to follow Renesas' guidelines for fault tolerance, redundancy, and fail-safe design. Additionally, consider using redundant components, error detection and correction mechanisms, and implementing safety protocols to ensure the system's integrity.

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72V265LA10TFG Overview

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