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73M1R010F - CTS

Description: 10 mOhms ±1% 1W Chip Resistor 2512 J-Lead Current Sense Thick Film

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73M1R010F - CTS PCB footprint - Other - Other - 73M1R010F-1
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73M1R010F - CTS  - 3D model - Other - 73M1R010F-1
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73M1R010F Details

  • Manufacturer Part Number:

    73M1R010F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, GREEN

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    CTS Corporation

  • YTEOL:

    8

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    180 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1 mm

  • Package Length:

    6.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.1 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.01 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2412

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    J BEND

  • Tolerance:

    1%

73M1R010F Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and avoid crossing them over each other.
  • Use a 10uF ceramic capacitor and a 100nF ceramic capacitor in parallel, placed as close as possible to the device's power pins. Ensure the capacitors are connected between the power pin and the ground pin.
  • The 73M1R010F can operate safely between -40°C to 85°C. However, it's recommended to derate the device's performance at temperatures above 70°C.
  • Yes, the 73M1R010F is designed to withstand vibrations up to 10g. However, it's recommended to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB.
  • Use an oscilloscope to monitor the input and output signals. Check for proper power supply voltage, decoupling, and PCB layout. Consult the datasheet and application notes for troubleshooting guidelines.

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