74030 footprint, schematic symbol and 3D model by MYRRA

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74030 Details

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended.
Use a decoupling capacitor (e.g., 10uF) close to the device, and ensure a stable power supply with minimal ripple (<50mV).
The maximum allowed voltage on the input pins is 5.5V, exceeding this may cause damage to the device.
Use ESD-safe materials, handle devices by the body or pins, and ground yourself before handling. Avoid touching pins or components.
Store the device in a dry, cool place (<30°C, <60% RH) in its original packaging or an ESD-safe container.

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