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74279214 - Würth Elektronik

Description: WE-CBF SMT EMI Suppression Ferrite Bead Size 1206; Z @ 100 MHz = 1000 Ω; Zmax = 1250 Ω @ 75 MHz; IR = 200 mA; RDC = 0.45 Ω

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PCB Footprints
74279214 - Würth Elektronik PCB footprint - Inductors Chip - Inductors Chip - 1206
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3D Models
74279214 - Würth Elektronik  - 3D model - Inductors Chip - 1206
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74279214 Details

  • Manufacturer Part Number:

    74279214

  • Brand Name:

    Wurth Electronik

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS AND REACH COMPLIANT, EIA STD PACKAGE SIZE 1206, SMD, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Wurth Elektronik

  • YTEOL:

    15

  • Case Code:

    1206

  • Construction:

    Multi-Layer

  • DC Resistance-Max:

    0.45 Ω

  • Filter Type:

    FERRITE CHIP

  • Frequency-Max:

    100 MHz

  • Frequency-Min:

    75 MHz

  • Height:

    1.1 mm

  • Length:

    3.2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    1000 OHM Ω

  • Packing Method:

    TAPE AND REEL

  • Rated Current:

    0.2 A

  • Width:

    1.6 mm

74279214 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 74279214 can be found in the Wurth Elektronik's PCB Library or in the component's 3D model. It's essential to follow the recommended footprint to ensure proper soldering and thermal management.
  • The 74279214 has a thermal pad on the bottom side, which should be connected to a thermal vias or a heat sink to dissipate heat efficiently. Ensure the PCB design allows for adequate heat dissipation to prevent overheating.
  • The 74279214 is rated for operation between -40°C to +125°C. However, it's essential to consider the derating curves and thermal management to ensure reliable operation within the specified temperature range.
  • The 74279214 is designed to withstand moderate vibrations. However, it's crucial to consider the specific vibration profile and ensure the component is properly secured to the PCB using recommended mounting techniques to prevent mechanical stress.
  • To ensure EMC, follow proper PCB design guidelines, such as using a solid ground plane, minimizing loop areas, and using shielding if necessary. Additionally, consider the component's radiation pattern and take measures to reduce electromagnetic interference (EMI).

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74279214 Overview

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