744042001 footprint, schematic symbol and 3D model by Würth Elektronik

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744042001 Details

The recommended PCB footprint for the 744042001 is a rectangular pad with a size of 3.2 mm x 1.6 mm, with a 0.5 mm spacing between pads.
To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB with a size of at least 10 mm x 10 mm, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK.
The maximum operating temperature range for the 744042001 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
For reflow soldering, it is recommended to use a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. The component should be placed on the PCB with the marking side facing upwards.
The recommended cleaning process for the 744042001 is to use a mild detergent and deionized water, followed by a drying process with a soft brush or air blow. Avoid using harsh chemicals or abrasive materials that may damage the component.

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