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744777222 - Würth Elektronik

Description: WE-PD SMT Shielded Power Inductor Size 7345; L = 220 µH ±20%; IR = 0.44 A; Isat = 0.54 A; RDC = 1170 mΩ

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PCB Footprints
744777222 - Würth Elektronik PCB footprint - Other - Other - 744777222-2
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3D Models
744777222 - Würth Elektronik  - 3D model - Other - 744777222-2
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744777222 Details

  • Manufacturer Part Number:

    744777222

  • Brand Name:

    Wurth Electronik

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Wurth Elektronik

  • YTEOL:

    15

  • Case/Size Code:

    2929

  • Construction:

    Rectangular

  • Core Material:

    MANGANESE-ZINC FERRITE

  • DC Resistance:

    1.17 Ω

  • Inductance-Nom (L):

    220 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e1

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    4.5 mm

  • Package Length:

    7.3 mm

  • Package Style:

    SMT

  • Package Width:

    7.3 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    0.44 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    5 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    20%

744777222 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 744777222 can be found in the Wurth Elektronik's PCB Library or in the component's 3D model. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • The 744777222 has a thermal pad on the bottom side, which should be connected to a thermal vias or a heat sink to dissipate heat efficiently. Ensure that the thermal interface material is compatible with the component and the PCB.
  • The 744777222 is rated for operation from -40°C to +125°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range. Consult the datasheet for specific derating information.
  • The 744777222 is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, you may need to consider additional mechanical support or vibration damping measures to ensure the component's reliability.
  • Follow the recommended soldering profile and temperature guidelines to ensure a reliable solder joint. Use a solder with a melting point compatible with the component's lead-free finish. Avoid overheating or applying excessive force during the soldering process.

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744777222 Overview

Use the download button to access the 744777222 schematic symbol, PCB footprint, and 3D model.
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Part Image BPSC00070745221M00 Chilisin Electronics Corp

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