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74CB3Q3257BQX - Nexperia

Description: 74CB3Q3257 - 4-bit 1-of-2 FET multiplexer/demultiplexer with charge pump@en-us

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74CB3Q3257BQX - Nexperia - PCB symbol
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PCB Footprints
74CB3Q3257BQX - Nexperia PCB footprint - Other - Other - 74CB3Q3257BQX-3
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74CB3Q3257BQX - Nexperia - 3D model - Other - 74CB3Q3257BQX-3
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74CB3Q3257BQX Details

  • Manufacturer Part Number:

    74CB3Q3257BQX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    DHVQFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT763-1

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.25

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.1X.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.6 mA

  • Prop. Delay@Nom-Sup:

    0.2 ns

  • Propagation Delay (tpd):

    0.2 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

74CB3Q3257BQX Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 74CB3Q3257BQX is a QFN24 package with a 4x4mm body size and 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design guidelines.
  • The 74CB3Q3257BQX requires a specific power sequencing to ensure proper operation. The VCC pin should be powered up before the VCCA pin, and the VCCA pin should be powered down before the VCC pin. A power sequencing circuit or a dedicated power management IC can be used to ensure correct power sequencing.
  • The maximum operating frequency of the 74CB3Q3257BQX is 100 MHz. However, the actual operating frequency may be limited by the system design, PCB layout, and signal integrity considerations.
  • To minimize power consumption in the 74CB3Q3257BQX, use the lowest possible supply voltage, minimize the clock frequency, and use the power-down mode when the device is not in use. Additionally, using a low-power mode or a dynamic voltage and frequency scaling (DVFS) technique can also help reduce power consumption.
  • The 74CB3Q3257BQX has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve thermal conductivity between the package and the PCB. Additionally, a heat sink or a thermal management system can be used to further reduce the junction temperature.

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74CB3Q3257BQX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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