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74FST3257DR2G - onsemi

Description: RON < 4 Ω Typical; Less Than 0.25 ns-Max Delay Through Switch; Nearly Zero Standby Current; No Circuit Bounce; Control Inputs are TTL/CMOS Compatible; Pin-For-Pin Compatible With QS3257, FST3257, CBT3257; All Popular Packages: QSOP-16, TSSOP-16, SOIC-16; Pb-Free Packages are Available

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74FST3257DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 CASE751B-05
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74FST3257DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-16 CASE751B-05
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74FST3257DR2G Details

  • Manufacturer Part Number:

    74FST3257DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC 16 LEAD

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

74FST3257DR2G Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the 74FST3257DR2G is 250 MHz.
  • To ensure signal integrity, use a low-impedance PCB design, minimize trace lengths, and use termination resistors as needed. Also, ensure that the power supply is clean and stable.
  • The recommended termination scheme for the 74FST3257DR2G is a series terminator (Rs) of 33-50 ohms, with a parallel terminator (Rt) of 50-100 ohms.
  • Power sequencing is critical when using the 74FST3257DR2G. Ensure that the VCC supply is powered up before the input signals, and that the input signals are stable before powering up the VCC supply.
  • The maximum power consumption of the 74FST3257DR2G is 1.5W.

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