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74HCT132D-Q100 - NXP

Description: Quad 2-input NAND Schmitt trigger

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PCB Footprints
74HCT132D-Q100 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO14: plastic small outline package; 14 leads; body width 3.9 mm
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3D Models
74HCT132D-Q100 - NXP  - 3D model - Small Outline Packages - SO14: plastic small outline package; 14 leads; body width 3.9 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 74HCT132D-Q100
  • Part Number 74HCT132D-Q100
  • Manufacturer NXP
  • Pin Count 14
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - SO14: plastic small outline package; 14 leads; body width 3.9 mm
  • Released Date Feb 22, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

74HCT132D-Q100 Details

  • Manufacturer Part Number:

    74HCT132D-Q100

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14

  • Pin Count:

    14

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • Family:

    HCT

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.65 mm

  • Logic IC Type:

    NAND GATE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    50 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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