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74LCX125MTC - onsemi

Description: 2.3V-3.6V VCC specifications provided; 5V tolerant inputs and outputs; Leadless Pb-Free DQFN package; 6.0 ns tPD max (VCC = 3.3V), 10 µA ICC max; ESD performance:Human body model > 2000VMachine model > 100V; Implements patented noise/EMI reduction circuitry; Latch-up performance exceeds JEDEC 78 conditions; Power down high impedance inputs and outputs; Supports live insertion/withdrawal (Note 1); ±24 mA output drive (VCC = 3.0V)

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74LCX125MTC - onsemi - PCB symbol
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PCB Footprints
74LCX125MTC - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MO-153 (TSSOP)
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3D Models
74LCX125MTC - onsemi - 3D model - Small Outline Packages - MO-153 (TSSOP)
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74LCX125MTC Details

  • Manufacturer Part Number:

    74LCX125MTC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 WB

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    4

  • Number of Ports:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    6 ns

  • Propagation Delay (tpd):

    7.2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

74LCX125MTC Frequently Asked Questions (FAQs)

  • The recommended PCB layout is to keep the device away from power supply lines and other noisy components. It's also recommended to use a ground plane and to keep the device's power and ground pins as close to the device as possible. Additionally, the device's input and output pins should be kept away from each other to minimize crosstalk.
  • The typical value of the input capacitance of the 74LCX125MTC is around 10-20 pF. However, this value can vary depending on the specific application and PCB layout.
  • Yes, the 74LCX125MTC can be used in high-frequency applications, but it's recommended to use a low-inductance PCB layout and to keep the device's power and ground pins as close to the device as possible. Additionally, the device's input and output pins should be kept away from each other to minimize crosstalk.
  • The recommended operating temperature range for the 74LCX125MTC is -40°C to 85°C. However, the device can operate outside of this range, but its performance may be affected.
  • Yes, the 74LCX125MTC has built-in ESD protection, but it's recommended to use a PCB layout that minimizes the risk of ESD damage. Additionally, it's recommended to use a ESD protection device on the input and output pins to provide additional protection.

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74LCX125MTC Overview

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