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74LCX760MTCX - onsemi

Description: 2.3V-3.6V VCC specifications provided; 5V tolerant inputs and outputs; Open drain version of the LCX244; Latch-up conforms to JEDEC JED78; Implements patented noise/EMI reduction circuitry; Supports live insertion/withdrawal (Note 1); 8.0 ns tPD max (VCC = 3.3V), 10 µA ICC max; 24 mA output drive (VCC = 3.0V); Power down high impedance inputs and outputs; ESD performance: Human body model > 2000V Machine model > 200V

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PCB Footprints
74LCX760MTCX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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74LCX760MTCX - onsemi  - 3D model - Small Outline Packages - 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 74LCX760MTCX
  • Part Number 74LCX760MTCX
  • Manufacturer onsemi
  • Pin Count 20
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
  • Released Date Jan 8, 2024
  • Last Modified Date Jan 22, 2025 4:53 PM UTC
  • Pinout / Pin List Click Here (Member Only)

74LCX760MTCX Details

  • Manufacturer Part Number:

    74LCX760MTCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-20

  • Package Description:

    TSSOP-20

  • Manufacturer Package Code:

    948AQ

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    8 ns

  • Propagation Delay (tpd):

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

74LCX760MTCX Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the 74LCX760MTCX is 2.3V to 3.6V.
  • To ensure signal integrity, use a low-impedance PCB design, minimize trace lengths, and use termination resistors as needed. Also, ensure that the power supply is clean and well-regulated.
  • No, the 74LCX760MTCX is not designed for 5V systems. It is optimized for low-voltage applications (2.3V to 3.6V). Using it in a 5V system may result in reduced performance, increased power consumption, or even damage to the device.
  • The 74LCX760MTCX has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Also, follow proper PCB design and layout guidelines to minimize thermal resistance.
  • The maximum frequency of operation for the 74LCX760MTCX is 250 MHz. However, this may vary depending on the specific application, PCB design, and operating conditions.

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