74LVC1G07GW - NXP

74LVC1G07GW Details

• Manufacturer Part Number:

  74LVC1G07GW

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  TSSOT

• Package Description:

  1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5

• Pin Count:

  5

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• Family:

  LVC/LCX/Z

• JESD-30 Code:

  R-PDSO-G5

• JESD-609 Code:

  e3

• Length:

  2.05 mm

• Logic IC Type:

  BUFFER

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Inputs:

  1

• Number of Terminals:

  5

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output Characteristics:

  OPEN-COLLECTOR

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP5/6,.08

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Packing Method:

  TR

• Peak Reflow Temperature (Cel):

  260

• Propagation Delay (tpd):

  8.4 ns

• Qualification Status:

  Not Qualified

• Schmitt Trigger:

  NO

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  1.65 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.25 mm