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74LVT16373MTDX - onsemi

Description: Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH16373), also available without bushold feature (74LVT16373); Latch-up performance exceeds 500 mA; Input and output interface capability to systems at 5V VCC; Functionally compatible with the 74 series 16373; Outputs source/sink -32 mA/+64 mA; Live insertion/extraction permitted; Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary); ESD performance:Human-body model > 2000VMachine model > 200

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PCB Footprints
74LVT16373MTDX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MTD48
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74LVT16373MTDX - onsemi  - 3D model - Small Outline Packages - MTD48
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74LVT16373MTDX Details

  • Manufacturer Part Number:

    74LVT16373MTDX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-48

  • Package Description:

    TSSOP-48

  • Manufacturer Package Code:

    948BQ

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVT

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.064 A

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    8

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    128 mA

  • Prop. Delay@Nom-Sup:

    3.9 ns

  • Propagation Delay (tpd):

    4.8 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

74LVT16373MTDX Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the 74LVT16373MTDX is 2.3V to 3.6V.
  • To ensure signal integrity, use a low-impedance PCB design, minimize trace lengths, and use termination resistors as needed. Also, ensure that the power supply is clean and stable.
  • The maximum frequency of operation for the 74LVT16373MTDX is 250 MHz.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid overheating the device. The maximum junction temperature is 150°C.
  • The 74LVT16373MTDX has human body model (HBM) ESD protection of ±2 kV and charged device model (CDM) ESD protection of ±500 V.

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74LVT16373MTDX Overview

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