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74SSTUBF32866BBFG8 - Renesas Electronics

Description: Along with CSPUA877A or 98ULPA877A DDR2 PLL Provides a fully JEDEC compliant solution for DDR2 RDIMMs for 400, 533, 667 and 800MHz.

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PCB Footprints
74SSTUBF32866BBFG8 - Renesas Electronics PCB footprint - BGA - BGA - bfg96
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74SSTUBF32866BBFG8 - Renesas Electronics  - 3D model - BGA - bfg96
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74SSTUBF32866BBFG8 Details

  • Manufacturer Part Number:

    74SSTUBF32866BBFG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    LFBGA-96

  • Pin Count:

    96

  • Manufacturer Package Code:

    BFG96

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW/HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    SSTU

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13.5 mm

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.006 A

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    25

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    96

  • Operating Temperature-Max:

    70 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA96,6X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    20 mA

  • Prop. Delay@Nom-Sup:

    1.5 ns

  • Propagation Delay (tpd):

    1.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    5.5 mm

74SSTUBF32866BBFG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN98074, which includes guidelines for signal routing, layer stacking, and decoupling capacitors to ensure optimal signal integrity.
  • The 74SSTUBF32866BBFG8 has a thermal pad on the bottom side, which should be connected to a thermal plane on the PCB. Additionally, Renesas recommends using thermal vias and a heat sink to dissipate heat effectively.
  • The 74SSTUBF32866BBFG8 has an operating temperature range of -40°C to +85°C, but it's essential to check the specific temperature range for your application, as it may vary depending on the use case.
  • Renesas provides guidelines for EMC in their application note AN98074, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference.
  • Renesas recommends a specific power-up sequence to ensure proper device operation. The sequence is: VCC, then VCCQ, and finally the input signals. This sequence helps prevent latch-up and ensures reliable operation.

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74SSTUBF32866BBFG8 Overview

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