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74VHC373MTC - onsemi

Description: Obsolete - Octal D-Type Latch with 3-STATE Outputs

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74VHC373MTC - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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74VHC373MTC - onsemi  - 3D model - Small Outline Packages - 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 74VHC373MTC
  • Part Number 74VHC373MTC
  • Manufacturer onsemi
  • Pin Count 20
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
  • Released Date Dec 16, 2017
  • Last Modified Date Sep 19, 2024 2:45 PM UTC
  • Pinout / Pin List Click Here (Member Only)

74VHC373MTC Details

  • Manufacturer Part Number:

    74VHC373MTC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-20

  • Package Description:

    TSSOP-20

  • Manufacturer Package Code:

    948AQ

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    AHC/VHC

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    10.5 ns

  • Propagation Delay (tpd):

    16.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

74VHC373MTC Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the 74VHC373MTC is typically 100 MHz, but it can vary depending on the specific application and operating conditions.
  • To ensure that the output signals are not distorted or attenuated, it is recommended to use a suitable output load, maintain a stable power supply voltage, and minimize the effects of noise and interference.
  • The maximum current that the 74VHC373MTC can sink or source is typically 25 mA per output pin, but it can vary depending on the specific application and operating conditions.
  • It is recommended to follow a controlled power-up and power-down sequence to prevent damage to the device and ensure reliable operation. A slow power-up and power-down ramp is recommended, with a maximum rate of change of 10 mV/μs.
  • The recommended operating temperature range for the 74VHC373MTC is -40°C to +125°C, but it can vary depending on the specific application and operating conditions.

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74VHC373MTC Overview

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For a full list of alternate parts for 74VHC373MTC, check out Findchips.com