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74VHCV17FT - Toshiba

Description: CMOS Digital Integrated Circuits Silicon Monolithic

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PCB Footprints
74VHCV17FT - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP14B
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3D Models
74VHCV17FT - Toshiba  - 3D model - Small Outline Packages - TSSOP14B
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74VHCV17FT Details

  • Manufacturer Part Number:

    74VHCV17FT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-14

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Family:

    AHC/VHC/H/U/V

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.016 A

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Power Supply Current-Max (ICC):

    0.04 mA

  • Prop. Delay@Nom-Sup:

    13.5 ns

  • Propagation Delay (tpd):

    29 ns

  • Schmitt Trigger:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

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