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75791-0001 - Molex

Description: AMC B+ EXTD HEIGHT VERS 170 CKT TIN/002

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PCB Footprints
75791-0001 - Molex PCB footprint - Other - Other - 75791-0001-2
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3D Models
75791-0001 - Molex  - 3D model - Other - 75791-0001-2
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75791-0001 Details

  • Manufacturer Part Number:

    75791-0001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Molex

  • YTEOL:

    0

  • Body Breadth:

    0.517 inch

  • Body Depth:

    0.906 inch

  • Body Length:

    2.945 inch

  • Body/Shell Style:

    RECEPTACLE

  • Connector Type:

    CARD EDGE CONNECTOR

  • Contact Finish Mating:

    AU ON NI

  • Contact Material:

    COPPER ALLOY

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    60 mΩ

  • Durability:

    200 Cycles

  • Filter Feature:

    NO

  • Insulation Resistance:

    10000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    GLASS FILLED LIQUID CRYSTAL POLYMER

  • Mating Contact Pitch:

    0.03 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    7

  • Number of Rows Loaded:

    7

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PCB Contact Pattern:

    STAGGERED

  • PCB Contact Row Spacing:

    1.6002 mm

  • Plating Thickness:

    30u inch

  • Rated Current (Signal):

    1 A

  • Reference Standard:

    UL, CSA

  • Terminal Pitch:

    2.2606 mm

  • Termination Type:

    PRESS FIT

  • Total Number of Contacts:

    170

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75791-0001 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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