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76165-5124 - Molex

Description: Impact 3X10 Gr Bp Assembly, 4.9 .46, Key B

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PCB Footprints
76165-5124 - Molex PCB footprint - Other - Other - 76165-5124-3
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3D Models
76165-5124 - Molex  - 3D model - Other - 76165-5124-3
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76165-5124 Details

  • Manufacturer Part Number:

    76165-5124

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    9

  • Body Breadth:

    0.657 inch

  • Body Depth:

    0.47 inch

  • Body Length:

    1.004 inch

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    AU ON NI

  • Contact Finish Termination:

    TIN OVER NICKEL

  • Contact Gender:

    MALE

  • Contact Material:

    COPPER ALLOY

  • Contact Pattern:

    RECTANGULAR

  • Contact Style:

    BLADE PIN-SKT

  • Filter Feature:

    NO

  • Insulator Material:

    GLASS FILLED LIQUID CRYSTAL POLYMER

  • Mating Contact Pitch:

    0.075 inch

  • Mating Contact Row Spacing:

    0.053 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    GUIDE PIN

  • Mounting Option 2:

    LOCKING

  • Mounting Style:

    STRAIGHT

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    9

  • Number of Rows Loaded:

    9

  • PCB Contact Pattern:

    RECTANGULAR

  • PCB Contact Row Spacing:

    1.35 mm

  • Plating Thickness:

    30u inch

  • Polarization Key:

    RIGHT

  • Rated Current (Signal):

    0.75 A

  • Reference Standard:

    UL

  • Terminal Length:

    0.055 inch

  • Terminal Pitch:

    1.905 mm

  • Termination Type:

    PRESS FIT

  • Total Number of Contacts:

    90

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76165-5124 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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