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76170-5110 - Molex

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76170-5110 - Molex  - 3D model
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76170-5110 Details

  • Manufacturer Part Number:

    76170-5110

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Singapore, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    9

  • Body Breadth:

    0.589 inch

  • Body Depth:

    0.949 inch

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Tin (Sn)

  • Contact Material:

    COPPER ALLOY

  • Contact Pattern:

    RECTANGULAR

  • Contact Style:

    SQ PIN-SKT

  • Filter Feature:

    NO

  • Insulator Material:

    GLASS FILLED LIQUID CRYSTAL POLYMER

  • JESD-609 Code:

    e3

  • Mating Contact Pitch:

    0.075 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    9

  • Number of Rows Loaded:

    9

  • PCB Contact Pattern:

    RECTANGULAR

  • PCB Contact Row Spacing:

    1.3462 mm

  • Plating Thickness:

    30u inch

  • Reference Standard:

    UL

  • Terminal Length:

    0.047 inch

  • Terminal Pitch:

    1.8542 mm

  • Termination Type:

    PRESS FIT

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76170-5110 Overview

Use the download button to access the 76170-5110 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 76170, or try a keyword search, such as Headers and Edge Type Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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