Murata recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 4-layer PCB is recommended, with the top layer for signals, the second layer for the power plane, the third layer for the ground plane, and the bottom layer for the signals.
The 78602/2C has a thermal pad on the bottom side, which should be connected to a thermal via or a heat sink to dissipate heat efficiently. Ensure that the thermal pad is soldered to a copper plane on the PCB to facilitate heat dissipation. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer.
Although the datasheet specifies an operating temperature range of -40°C to +85°C, Murata recommends derating the device's performance at temperatures above +70°C to ensure reliability and longevity. It's essential to consider the application's temperature profile and potential thermal stresses when designing with the 78602/2C.
To ensure EMC, follow Murata's recommended PCB layout guidelines, use a shielded enclosure, and implement proper filtering and shielding techniques. Additionally, consider using electromagnetic absorbers or ferrite beads to reduce EMI radiation. It's also essential to perform EMC testing and certification according to relevant standards (e.g., CISPR, FCC, or CE).
Store the 78602/2C in a dry, cool place, away from direct sunlight and moisture. Handle the devices with anti-static wrist straps, mats, or bags to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads, and use a vacuum pick-up tool or tweezers to handle the devices.
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About Murata Electronics
Murata Manufacturing Co., Ltd. is a Japanese multinational company that specializes in the design, manufacturing, and sale of electronic components and solutions.
Murata offers a wide range of electronic components and modules that are used in various industries and applications. Some of their key product categories include: capacitors, inductors, resistors, sensors, rf components and modules, and power devices.
