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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for 78Q2123/F
- Part Number 78Q2123/F
- Manufacturer Analog Devices
- Pin Count 33
- Part Category Integrated Circuit
- Package Category Other
- Footprint Name Other - QFN50P500X500X90-33N
- Released Date Jan 11, 2017
- Last Modified Date Nov 15, 2024 1:35 PM UTC
- Pinout / Pin List Click Here (Member Only)
78Q2123/F Details
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Manufacturer Part Number:
78Q2123/F
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Brand Name:
Analog Devices Inc
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Rohs Code:
Yes
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Part Life Cycle Code:
Not Recommended
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Part Package Code:
32-LFCSP-5X5X0.85
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Package Description:
5 X 5 MM, LEAD FREE, QFN-32
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Pin Count:
32
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Manufacturer Package Code:
32-LFCSP-5X5X0.85
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Country Of Origin:
Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA
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HTS Code:
8542.39.00.01
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Date Of Intro:
2010-07-27
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Manufacturer:
Analog Devices Inc
78Q2123/F Frequently Asked Questions (FAQs)
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A good thermal design is crucial for the 78Q2123/F. It's recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the IC to dissipate heat efficiently. Additionally, keep the component placement and routing symmetrical to minimize thermal gradients.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, such as using a heat sink, thermal interface material, and ensuring good airflow. Additionally, consider derating the device's power dissipation and operating frequency according to the datasheet's thermal specifications.
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For optimal performance, it's recommended to use low-ESR capacitors with a value of 10uF to 22uF for the input and output capacitors. The capacitor's voltage rating should be at least 1.5 times the maximum input voltage. Additionally, consider using X7R or X5R dielectric capacitors for their stability over temperature and voltage.
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To troubleshoot common issues like output voltage sag or oscillation, start by checking the PCB layout for any thermal or electrical issues. Verify that the input and output capacitors are properly selected and placed. Check the device's operating frequency and ensure it's within the recommended range. If the issue persists, consult the datasheet's troubleshooting section or contact Analog Devices' support team.
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Different package types can affect the design in terms of thermal performance, PCB layout, and assembly. For example, the QFN package has a exposed pad that requires a thermal connection to the PCB, while the LFCSP package has a smaller footprint but may require more complex PCB routing. Ensure that the chosen package type is compatible with the design requirements and follows the recommended PCB layout guidelines.
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78Q2123/F Overview
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About Analog Devices
Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries.
Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.