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7UL1G14FU,LF - Toshiba

Description: Inverters One-Gate Logic(L-MOS), Inverter, SOT-353(USV) Vcc:0.9-3.6V Io:8.0mA

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Symbol
7UL1G14FU,LF - Toshiba - PCB symbol
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PCB Footprints
7UL1G14FU,LF - Toshiba PCB footprint - Other - Other - 7UL1G14FU,LF-2
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3D Models
7UL1G14FU,LF - Toshiba - 3D model - Other - 7UL1G14FU,LF-2
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7UL1G14FU,LF Details

  • Manufacturer Part Number:

    7UL1G14FU,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    USV-5

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Family:

    AUP/ULP/V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    INVERTER

  • Max I(ol):

    0.008 A

  • Number of Functions:

    1

  • Number of Inputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Power Supply Current-Max (ICC):

    0.08 mA

  • Prop. Delay@Nom-Sup:

    6.7 ns

  • Propagation Delay (tpd):

    73.1 ns

  • Schmitt Trigger:

    YES

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

7UL1G14FU,LF Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 7UL1G14FU,LF is a 1.6mm x 1.2mm QFN package with a 0.5mm pitch. It's essential to follow the recommended land pattern to ensure proper thermal and electrical performance.
  • The 7UL1G14FU,LF has a thermal pad on the bottom, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal via array or a copper pour with a thermal relief pattern can be used to improve heat dissipation.
  • The 7UL1G14FU,LF has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
  • Yes, the 7UL1G14FU,LF is suitable for high-reliability and automotive applications. It meets the AEC-Q100 qualification standard for automotive-grade ICs and is designed to operate in harsh environments.
  • The 7UL1G14FU,LF requires a controlled power-up and power-down sequence to prevent latch-up or damage. A soft-start circuit or a power sequencer can be used to ensure the device is properly biased during power transitions.

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7UL1G14FU,LF Overview

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