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8003-08T3U - OUPIN

Description: 8 pin DIL IC socket with dual wipe and tin plated phosphor ... Altronics Code: P0550; Manufacturer's Code

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Symbol
8003-08T3U - OUPIN - PCB symbol
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PCB Footprints
8003-08T3U - OUPIN PCB footprint - Other - Other - 8003-08T3U-4
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3D Models
8003-08T3U - OUPIN - 3D model - Other - 8003-08T3U-4
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8003-08T3U Details

  • Manufacturer Part Number:

    8003-08T3U

  • Part Life Cycle Code:

    Contact Manufacturer

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Oupiin

  • Body Breadth:

    0.4 inch

  • Body Depth:

    0.2 inch

  • Body Length:

    0.4 inch

  • Contact Finish Mating:

    SN

  • Contact Finish Termination:

    TIN

  • Contact Material:

    CU ALLOY

  • Contact Style:

    SQ PIN-SKT

  • Current Rating:

    1 A

  • Device Socket Type:

    IC SOCKET

  • Device Type Used On:

    DIP8

  • Dielectric Withstanding Voltage:

    500VAC V

  • Housing Material:

    GLASS FILLED THERMOPLASTIC

  • Insulation Resistance:

    1000000000 Ω

  • Mating Contact Pitch:

    0.1 inch

  • Mounting Style:

    STRAIGHT

  • Number of Contacts:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • PCB Contact Pattern:

    RECTANGULAR

  • PCB Contact Row Spacing:

    0.30000000000000004 mm

  • Terminal Pitch:

    2.54 mm

  • Termination Type:

    SOLDER

8003-08T3U Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer PCB with a solid ground plane on the bottom layer can help with heat dissipation. Keep the thermal path as short as possible.
  • Use a stable clock source, ensure proper signal termination, and maintain a clean power supply. Also, follow the recommended PCB layout and routing guidelines to minimize noise and interference.
  • The recommended operating temperature range is -40°C to 85°C. However, the device can tolerate up to 100°C for short periods, but this may affect its reliability and lifespan.
  • Yes, but ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Also, consider using a vibration-dampening material to minimize the impact of vibrations on the device.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input/output lines. Also, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.

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8003-08T3U Overview

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