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802-10-008-10-007000 - Mill-Max

Description: Headers & Wire Housings SolderCup Head Double Row, 8P

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PCB Footprints
802-10-008-10-007000 - Mill-Max PCB footprint - Other - Other - 802-10-008-10-007000-3
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3D Models
802-10-008-10-007000 - Mill-Max  - 3D model - Other - 802-10-008-10-007000-3
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802-10-008-10-007000 Details

  • Manufacturer Part Number:

    802-10-008-10-007000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.90.40.00

  • Manufacturer:

    Mill-Max Mfg Corp

  • YTEOL:

    10

  • Body Depth:

    0.11 inch

  • Body Length:

    0.4 inch

  • Body/Shell Style:

    SOCKET

  • Connector Type:

    BOARD CONNECTOR

  • Contact Design:

    STAMPED

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Gold (Au) - with Nickel (Ni) barrier

  • Contact Gender:

    MALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Style:

    RND PIN-SKT

  • Dielectric Withstanding Voltage:

    1000VAC V

  • Filter Feature:

    NO

  • Insulation Resistance:

    10000000000 Ω

  • Insulator Material:

    POLYETHYLENE

  • JESD-609 Code:

    e4

  • Mating Contact Pitch:

    0.1 inch

  • Mating Contact Row Spacing:

    0.1 inch

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Type:

    CABLE

  • Number Of Connectors:

    ONE

  • Number of Rows Loaded:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Option:

    GENERAL PURPOSE

  • Packing Method:

    BOX; TUBE

  • Plating Thickness:

    10u inch

  • Terminal Length:

    0.165 inch

  • Terminal Pitch:

    2.54 mm

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    8

  • Wire Size-Max:

    18 AWG

  • Wire Size-Min:

    20 AWG

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802-10-008-10-007000 Overview

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