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80SQ045NG - onsemi

Description: High Current Capability; Low Stored Charge, Majority Carrier Conduction; Low Power Loss/High Efficiency; Highly Stable Oxide Passivated Junction; Guard-Ring for Stress Protection; Low Forward Voltage; High Surge Capacity Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 1.1 gram (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 220?C Max. for 10 Seconds, 1/16, from case; Shipped

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Symbol
80SQ045NG - onsemi - PCB symbol
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PCB Footprints
80SQ045NG - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - AXIAL-LEAD-CASE 267-05
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3D Models
80SQ045NG - onsemi - 3D model - Diodes, Axial Diameter Horizontal Mounting - AXIAL-LEAD-CASE 267-05
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80SQ045NG Details

  • Manufacturer Part Number:

    80SQ045NG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Axial Lead 9.65x5.33mm, 25.4x1.22mm Pkg, Lead len/dia

  • Package Description:

    LEAD FREE, PLASTIC, CASE 267-05, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    267-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.95

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    45 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JEDEC-95 Code:

    DO-201AD

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    140 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

80SQ045NG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Also, consider derating the device's power handling at high temperatures.
  • The device has internal ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded.
  • Yes, the 80SQ045NG is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards (e.g., AEC-Q101). Consult with onsemi's application engineers for guidance.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check for proper power supply voltage, decoupling, and signal integrity. Consult onsemi's application notes and technical support resources for troubleshooting guides and FAQs.

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80SQ045NG Overview

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