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82P2284BBG - Renesas Electronics

Description: 4-Channel T1/E1/J1 Transceiver (Line Interface Unit + Framer) with clock recovery and SSM support, optimized for telecommunication applications such as Central Office, PABX, Wireless Base Stations, T1/E1/J1 ATM Gateways, Multiplexers, LAN/WAN Routers, SONET/SDH Add/Drop Equipment

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82P2284BBG - Renesas Electronics PCB footprint - BGA - BGA - bbg208
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82P2284BBG - Renesas Electronics  - 3D model - BGA - bbg208
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82P2284BBG Details

  • Manufacturer Part Number:

    82P2284BBG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PBGA

  • Package Description:

    GREEN, PLASTIC, BGA-208

  • Pin Count:

    208

  • Manufacturer Package Code:

    BBG208

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Carrier Type:

    T-1(DS1)

  • Carrier Type (2):

    T-1(DS1)

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA208,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.97 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    PCM TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

82P2284BBG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow around the device. Also, reduce the power consumption by optimizing the system design and using power-saving modes.
  • Critical timing parameters include clock frequency, clock skew, and setup/hold times. Ensure these parameters are met by using a clock generator with a stable frequency, and by adding buffers or delay lines to the clock signal if necessary.
  • Use a logic analyzer or oscilloscope to capture the signals and identify the source of the issue. Check the power supply voltage, clock signal, and reset signal for any anomalies. Also, review the firmware code for any potential issues.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines, and ensure that the PCB has a solid ground plane and a separate power plane. Also, handle the device by the body or use an anti-static wrist strap to prevent ESD damage.

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82P2284BBG Overview

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