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831724AKILF - Renesas Electronics

Description: The 831724I is a high-performance, differential HCSL clock/data multiplexer and fanout buffer. The device is designed for the multiplexing and fanout of high-frequency clock and data signals. The device has two differential, selectable clock/data inputs. The selected input signal is distributed to four low-skew differential HCSL outputs. Each input pair accepts HCSL, LVDS, LVPECL and SSTL levels. The 831724I is characterized to operate from a 3.3V power supply. Guaranteed input, output-to-output and part-to

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831724AKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (32-pin 5mm x 5mm QFN)
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831724AKILF - Renesas Electronics  - 3D model - Quad Flat No-Lead - (32-pin 5mm x 5mm QFN)
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831724AKILF Details

  • Manufacturer Part Number:

    831724AKILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    32

  • Manufacturer Package Code:

    NLG32P1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • Family:

    831724

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    128 mA

  • Prop. Delay@Nom-Sup:

    3.9 ns

  • Propagation Delay (tpd):

    3.9 ns

  • Same Edge Skew-Max (tskwd):

    0.175 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • fmax-Min:

    350 MHz

831724AKILF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended to ensure optimal thermal performance. Additionally, placing thermal pads under the package can help to dissipate heat more efficiently.
  • To ensure reliable communication, make sure to follow the recommended bus termination and pull-up resistor values, and implement proper signal routing and shielding to minimize electromagnetic interference (EMI).
  • The 831724AKILF requires a specific power sequencing order to prevent damage. The recommended sequence is to power up the VCCIO pin first, followed by the VCC core voltage, and then the analog voltage (VCCA).
  • The 831724AKILF has multiple power modes, including sleep, standby, and shutdown. To minimize power consumption, use the lowest power mode necessary for your application, and consider using dynamic voltage and frequency scaling (DVFS) to optimize power consumption.
  • To prevent electrostatic discharge (ESD) damage, use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines, and follow proper handling and storage procedures to minimize the risk of ESD damage.

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