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83210AYLF - Renesas Electronics

Description: The 83210 is a low skew, 1-to-10 HSTL Fanout Buffer. The class II HSTL outputs are balanced push-pull in design, capable of delivering 16mA into a 10pF load. This class allows both source series termination and symmetrically double parallel termination.

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PCB Footprints
83210AYLF - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 32 LEAD TQFP
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83210AYLF - Renesas Electronics  - 3D model - Quad Flat Packages - 32 LEAD TQFP
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83210AYLF Details

  • Manufacturer Part Number:

    83210AYLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Package Description:

    TQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    ERG32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    83210

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.016 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    250 mA

  • Prop. Delay@Nom-Sup:

    5.5 ns

  • Propagation Delay (tpd):

    5.5 ns

  • Same Edge Skew-Max (tskwd):

    0.11 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    1.62 V

  • Supply Voltage-Min (Vsup):

    1.38 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

83210AYLF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme in their application note (APL-AN-1202) to ensure proper device operation. The sequence involves powering up the VCC, then the VDD, and finally the AVCC, with a specific delay between each power-up event.
  • Renesas recommends using 0.1uF to 1uF decoupling capacitors with a voltage rating of 10V or higher, placed as close as possible to the power pins of the device. The capacitors should be rated for high-frequency operation and have a low equivalent series resistance (ESR).
  • Renesas provides a JTAG interface specification in their application note (APL-AN-1203) which includes guidelines for production testing, such as signal voltage levels, clock frequency, and boundary scan implementation.
  • The thermal resistance values for the 83210AYLF package are not explicitly stated in the datasheet, but can be found in the Renesas package thermal resistance document (Renesas Document No. R01DS0243EJ0100). The values are: RθJA = 35°C/W, RθJC = 10°C/W, and ψJT = 20°C/W.

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