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83940DYILF - Renesas Electronics

Description: The 83940DI is a low skew, 1-to-18 LVPECL- to-LVCMOS/LVTTL Fanout Buffer. The 83940DI has two selectable clock inputs. The PCLK, nPCLK pair can accept LVPECL, CML, or SSTL input levels. The LVCMOS_CLK can accept LVCMOS or LVTTL input levels. The low impedance LVCMOS/LVTTL outputs are designed to drive 50Ω series or parallel terminated transmission lines. The 83940DI is characterized at full 3.3V and 2.5V or mixed 3.3V core, 2.5V output operating supply modes. Guaranteed output and part-to-part skew characte

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83940DYILF - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PRG32
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83940DYILF - Renesas Electronics  - 3D model - Quad Flat Packages - PRG32
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83940DYILF Details

  • Manufacturer Part Number:

    83940DYILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Package Description:

    LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    PRG32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    83940

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.02 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    25 mA

  • Prop. Delay@Nom-Sup:

    3.8 ns

  • Propagation Delay (tpd):

    3.8 ns

  • Same Edge Skew-Max (tskwd):

    0.2 ns

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • fmax-Min:

    250 MHz

83940DYILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3601EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends a specific power sequencing scheme in their application note (R01AN3601EU0100) to ensure proper device operation. The sequence involves powering up the VCC, then the VDD, and finally the AVCC and DVCC.
  • Renesas recommends using 0.1uF to 1uF decoupling capacitors with a voltage rating of 10V or higher, placed as close as possible to the power pins. The application note (R01AN3601EU0100) provides more detailed guidance on decoupling capacitor selection and placement.
  • Renesas provides a JTAG interface specification in their datasheet, but for production testing, it's recommended to use a JTAG adapter or a boundary scan tool, such as Renesas' own E1 emulator, to access the device's JTAG interface.
  • The exposed pad on the 83940DYILF is a thermal pad that should be connected to a thermal ground plane on the PCB. Renesas recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K to ensure efficient heat transfer.

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