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841654AGILF - Renesas Electronics

Description: The 841654I is an optimized PCIe and sRIO clock generator and member of the family of high-performance clock solutions from IDT. The device uses a 25MHz parallel crystal to generate 100MHz and 125MHz clock signals, replacing solutions requiring multiple oscillator and fanout buffer solutions. The device has excellent phase jitter (< 1ps rms) suitable to clock components requiring precise and low-jitter PCIe or sRIO or both clock signals. Designed for telecom, networking and industrial applications, the 8416

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841654AGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 28 LEAD TSSOP
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841654AGILF - Renesas Electronics  - 3D model - Small Outline Packages - 28 LEAD TSSOP
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841654AGILF Details

  • Manufacturer Part Number:

    841654AGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    28

  • Manufacturer Package Code:

    DQG28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Clock Frequency-Max:

    125 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    25 MHz

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    85 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    6.1 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, OTHER

841654AGILF Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power plane.
  • Implement a robust communication protocol with error detection and correction mechanisms, such as CRC and checksums. Ensure proper signal termination, and use a common clock source to synchronize devices on the bus.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure a minimum of 10 ms delay between each power-up step to prevent latch-up.
  • Use a metal shield or a Faraday cage to enclose the device, and ensure proper grounding and decoupling of power supplies. Implement EMI filters and shielding on I/O lines to minimize radiation.
  • Ensure a minimum of 10 mm clearance around the device for airflow, and use a heat sink with a thermal interface material (TIM) to dissipate heat. Avoid blocking airflow vents and ensure good thermal conductivity between the device and heat sink.

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841654AGILF Overview

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