Description:The 843256I is a Crystal-to-3.3V LVPECL Clock Synthesizer/Fanout Buffer designed for Fibre Channel and Gigabit Ethernet applications. The output frequency can be set using the frequency select pins and a 25MHz crystal for Ethernet frequencies, or a 19.44MHz crystal for SONET. The low phase noise characteristics of the 843256I make it an ideal clock for these demanding applications.
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Primary Clock/Crystal Frequency-Nom:
25.5 MHz
Seated Height-Max:
1.1 mm
Supply Current-Max:
190 mA
Supply Voltage-Max:
3.465 V
Supply Voltage-Min:
3.135 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
TIN
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
4.4 mm
uPs/uCs/Peripheral ICs Type:
CLOCK GENERATOR, OTHER
843256BGILF Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, copper pours, and other layout considerations to ensure optimal thermal performance.
Renesas recommends following the power sequencing guidelines outlined in the datasheet, which involves powering up the VCC and VDD pins in a specific order. Additionally, Renesas provides a power sequencing application note that provides more detailed information and examples.
Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1uF to 1uF, placed as close as possible to the power pins. The exact capacitor value and type may vary depending on the specific application and operating conditions.
Renesas provides a troubleshooting guide in their datasheet and application notes, which covers common issues and their solutions. Additionally, engineers can use Renesas' online support resources, such as FAQs and knowledge base articles, to find answers to specific questions.
Renesas provides thermal design guidelines in their datasheet and application notes, which include information on thermal resistance, junction temperature, and heat sink design. Engineers should also consider the operating environment, airflow, and heat sink design to ensure optimal thermal performance.
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843256BGILF Overview
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