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8546AG-01LF - Renesas Electronics

Description: The 8546-01 is a low skew, high performance 1-to-6 Crystal Oscillator-to-LVDS Fanout Buffer. The 8546-01 has selectable crystal, single ended or differential clock inputs. The single-ended clock input accepts LVCMOS or LVTTL input levels and translate them to LVDS levels. The CLK1, nCLK1 pair can accept most standard differential input levels. The output enable is internally synchronized to eliminate runt pulses on the outputs during asynchronous assertion/ deassertion of the clock enable pin. Guaranteed ou

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8546AG-01LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - G Suffix for 24 Lead TSSOP_
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8546AG-01LF - Renesas Electronics  - 3D model - Small Outline Packages - G Suffix for 24 Lead TSSOP_
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8546AG-01LF Details

  • Manufacturer Part Number:

    8546AG-01LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PGG24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATE AT 3.3V SUPPLY

  • Family:

    8546

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    70 mA

  • Prop. Delay@Nom-Sup:

    2.45 ns

  • Propagation Delay (tpd):

    2.45 ns

  • Same Edge Skew-Max (tskwd):

    0.055 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    266 MHz

8546AG-01LF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3804EJ0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends following their thermal design guidelines, using a heat sink if necessary, and ensuring proper airflow around the device. Additionally, the device's thermal shutdown feature can be enabled to prevent damage from overheating.
  • Renesas recommends using a low-ESR ceramic capacitor (e.g., X5R or X7R) for CIN, with a value between 4.7uF to 10uF. For COUT, a low-ESR ceramic or electrolytic capacitor with a value between 10uF to 22uF is recommended. The specific values depend on the application's requirements and should be determined through simulation and testing.
  • Renesas recommends using a higher value for the input capacitor (CIN) and ensuring that the input voltage is stable and within the recommended range. Additionally, the device's internal voltage regulator can be adjusted to optimize performance at low input voltages.
  • Renesas recommends following their EMI and EMC design guidelines, which include using a shielded layout, minimizing loop areas, and using EMI filters or common-mode chokes as necessary. Additionally, the device's switching frequency can be adjusted to minimize EMI emissions.

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8546AG-01LF Overview

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