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854S006AGILF - Renesas Electronics

Description: The 854S006I is a low skew, high performance 1-to-6 Differential-to-LVDS Fanout Buffer. The CLK, nCLK pair can accept most standard differential input levels. The 854S006I is characterized to operate from either a 2.5V or a 3.3V power supply. Guaranteed output skew characteristics make the 854S006I ideal for those clock distribution applications demanding well defined performance and repeatability.

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854S006AGILF - Renesas Electronics - PCB symbol
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PCB Footprints
854S006AGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG24*
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854S006AGILF - Renesas Electronics - 3D model - Small Outline Packages - PGG24*
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854S006AGILF Details

  • Manufacturer Part Number:

    854S006AGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PGG24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    ALSO OPERATE AT 3.3V SUPPLY

  • Family:

    854S

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    55 mA

  • Prop. Delay@Nom-Sup:

    0.85 ns

  • Propagation Delay (tpd):

    0.85 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.055 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    1700 MHz

854S006AGILF Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for heat dissipation. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
  • Use a 4-layer PCB with a solid ground plane, and route critical signals on inner layers. Implement a decoupling capacitor network and follow the recommended pinout and signal routing guidelines. Ensure a minimum of 3mm clearance between the package and any nearby metal objects.
  • The 854S006AGILF requires a power-on reset (POR) circuit to ensure proper startup. The recommended power sequencing is VCC, then VCCIO, and finally VREF. The voltage ramp-up rate should be 1-2 ms/V to prevent latch-up.
  • Handle the device in an ESD-controlled environment, using wrist straps, anti-static bags, and ESD-safe workbenches. Store the device in its original packaging or an anti-static bag, away from direct sunlight and moisture.
  • Perform functional testing, including input/output signal verification, clock signal validation, and power consumption measurement. Use a logic analyzer or oscilloscope to verify signal integrity and timing. Validate the device's performance using a thermal chamber and environmental testing.

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854S006AGILF Overview

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