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87004BGI-03LF - Renesas Electronics

Description: The 87004I-03 is a low skew, ÷1, ÷2 ÷3, ÷4 ÷5, ÷6 ÷8, ÷16 LVCMOS/LVTTL Fanout Buffer/Divider. The 87004I-03 has selectable clock inputs that accept single ended input levels. Output enable pin controls whether the output is in the active or high impedance state. The 87004I-03 is characterized at 3.3V, 2.5V and mixed 3.3V,2.5V, 3.3V,1.8V, 2.5V,1.8V input/output supply operating modes.Guaranteed bank, output, and part-to-part skew characteristics make the 87004I-03 ideal for those applications demanding well

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87004BGI-03LF - Renesas Electronics - PCB symbol
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87004BGI-03LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - - G Suffix for 20 Lead TSSOP
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87004BGI-03LF - Renesas Electronics - 3D model - Small Outline Packages - - G Suffix for 20 Lead TSSOP
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87004BGI-03LF Details

  • Manufacturer Part Number:

    87004BGI-03LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATABLE AT 3.3V NOM

  • Family:

    87004

  • Input Conditioning:

    MUX

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    55 mA

  • Prop. Delay@Nom-Sup:

    7.5 ns

  • Propagation Delay (tpd):

    7.5 ns

  • Same Edge Skew-Max (tskwd):

    0.2 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    250 MHz

87004BGI-03LF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, copper pours, and other layout considerations to ensure optimal thermal performance.
  • Renesas provides a power sequencing guide in their datasheet and application notes. The device has a specific power-up and power-down sequence that must be followed to ensure proper operation and prevent damage. The sequence typically involves powering up the voltage rails in a specific order and with specific timing.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1uF to 1uF, placed as close as possible to the device's power pins. The capacitors should be rated for the maximum operating voltage and have a low inductance to minimize noise and ripple.
  • Renesas provides troubleshooting guides and FAQs on their website, which cover common issues and their solutions. Engineers can also contact Renesas' technical support team for assistance. Additionally, using oscilloscopes, logic analyzers, and other debugging tools can help identify and isolate issues.
  • The 87004BGI-03LF is rated for operation in the industrial temperature range of -40°C to 85°C, with a storage temperature range of -55°C to 125°C. It is also rated for operation in humid environments, but may require additional protection measures such as conformal coating or hermetic sealing in extreme environments.

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