- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for 88E1111-B2-BAB-I000
- Part Number 88E1111-B2-BAB-I000
- Manufacturer Marvell
- Pin Count 117
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - 117-pin TFBGA
- Released Date Nov 24, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
88E1111-B2-BAB-I000 Details
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Manufacturer Part Number:
88E1111-B2-BAB-I000
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Part Life Cycle Code:
Obsolete
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Part Package Code:
BGA
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Package Description:
TFBGA-117
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Pin Count:
117
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HTS Code:
8542.39.00.01
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Manufacturer:
Marvell Technology Group Ltd
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YTEOL:
0
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Additional Feature:
IT ALSO REQUIRES 2.5V DIGITAL SUPPLY
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Data Rate:
1000000 Mbps
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JESD-30 Code:
R-PBGA-B117
88E1111-B2-BAB-I000 Frequently Asked Questions (FAQs)
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Marvell provides a reference design guide that includes recommended PCB layout guidelines for optimal performance, thermal management, and signal integrity. It's essential to follow these guidelines to ensure reliable operation and minimize electromagnetic interference (EMI).
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The 88E1111-B2-BAB-I000 supports various network topologies, including point-to-point, star, and bus configurations. Configuration is done through the device's registers, and Marvell provides a software development kit (SDK) with example code and documentation to help with configuration and customization.
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The 88E1111-B2-BAB-I000 has multiple power management modes, including Energy-Efficient Ethernet (EEE) and Wake-on-LAN (WOL) support. These features can be configured through the device's registers or using the SDK provided by Marvell.
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Marvell provides a range of debugging tools, including a logic analyzer and a protocol analyzer, to help troubleshoot issues with the device. Additionally, the SDK includes diagnostic software and documentation to aid in debugging and testing.
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The 88E1111-B2-BAB-I000 has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, airflow, and thermal interface materials.
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88E1111-B2-BAB-I000 Overview
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