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89H48T12G2ZCBLG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and eleven downstream ports or peer-to-peer switching between downstream ports.

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PCB Footprints
89H48T12G2ZCBLG - Renesas Electronics PCB footprint - BGA - BGA - BL676
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89H48T12G2ZCBLG - Renesas Electronics  - 3D model - BGA - BL676
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89H48T12G2ZCBLG Details

  • Manufacturer Part Number:

    89H48T12G2ZCBLG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-676

  • Pin Count:

    676

  • Manufacturer Package Code:

    BLG676

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Peak Reflow Temperature (Cel):

    245

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89H48T12G2ZCBLG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring proper airflow around the device. Additionally, consider using thermal interface materials and following the recommended operating temperature range.
  • Renesas recommends using a low-ESR capacitor (e.g., ceramic or film capacitor) for CIN, with a value between 1-10uF. For COUT, a low-ESR capacitor with a value between 10-100uF is recommended. The specific values depend on the application's requirements and should be determined through simulation and testing.
  • Renesas recommends following the guidelines in their application note (APL-AN-1201) for EMI reduction, including using a solid ground plane, minimizing loop areas, and placing components to reduce radiation. Additionally, consider using EMI filters and shielding if necessary.
  • Renesas recommends using a pi-filter (L-C-L) or a common-mode choke for VIN filtering to reduce noise and ripple. For VOUT filtering, a simple RC filter or a more complex filter (e.g., LC filter) can be used, depending on the application's requirements.

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