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89H64H16G2ZCBLGI - Renesas Electronics

Description: Provides 64 PCIe Gen2 lanes and 16 ports of high-performance, deterministic system interconnect switching. All ports receive full line rate, non-blocking throughput for multiple traffic flows regardless of switch loading.

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89H64H16G2ZCBLGI - Renesas Electronics - PCB symbol
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89H64H16G2ZCBLGI - Renesas Electronics PCB footprint - BGA - BGA - BLG1156
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89H64H16G2ZCBLGI - Renesas Electronics - 3D model - BGA - BLG1156
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89H64H16G2ZCBLGI Details

  • Manufacturer Part Number:

    89H64H16G2ZCBLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-1156

  • Pin Count:

    1156

  • Manufacturer Package Code:

    BLG1156

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    I2C; ISA; PCI; SMBUS; VGA

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    64000 MBps

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Current-Max:

    6275 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89H64H16G2ZCBLGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note 'Renesas Microcontrollers Thermal Design Guide' (document number: R01CL0005EJ0100). It's essential to follow this guide to ensure optimal thermal performance and prevent overheating issues.
  • Renesas provides a Secure Boot and Firmware Encryption guide (document number: R01AN4334EJ0100) that explains the process of implementing secure boot and firmware encryption using the 89H64H16G2ZCBLGI's built-in security features, such as the Trusted Secure IP (TSIP) and the Advanced Encryption Standard (AES).
  • Renesas recommends using their e² studio integrated development environment (IDE) and the E1/E20 emulator for debugging and troubleshooting. Additionally, they provide a debugging guide (document number: R01AN4335EJ0100) that covers common issues and troubleshooting techniques.
  • Renesas provides a Power Management Guide (document number: R01AN4336EJ0100) that explains how to optimize power consumption and reduce energy usage on the 89H64H16G2ZCBLGI. This includes techniques such as clock gating, voltage scaling, and sleep mode optimization.
  • Renesas provides a compatibility and interoperability guide (document number: R01AN4337EJ0100) that explains how to ensure compatibility and interoperability between the 89H64H16G2ZCBLGI and other Renesas devices, such as memory devices, interface devices, and power management devices.

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89H64H16G2ZCBLGI Overview

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