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89HPES10T4G2ZBBCG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and three downstream ports or peer-to-peer switching between downstream ports.

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89HPES10T4G2ZBBCG - Renesas Electronics PCB footprint - BGA - BGA - BCG 324
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89HPES10T4G2ZBBCG - Renesas Electronics  - 3D model - BGA - BCG 324
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89HPES10T4G2ZBBCG Details

  • Manufacturer Part Number:

    89HPES10T4G2ZBBCG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    324

  • Manufacturer Package Code:

    BCG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO HAVING 125MHZ REFERENCE CLOCK.

  • Bus Compatibility:

    PCI; SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    12000 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES10T4G2ZBBCG Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guidelines in their application notes and design resources. It's essential to follow these guidelines to ensure proper heat dissipation, signal integrity, and power delivery.
  • Renesas provides power management guidelines and recommends using their PowerNavigator software to optimize power consumption and delivery. Additionally, engineers can use simulation tools to model and optimize the power management system.
  • Renesas provides guidelines for PLL and clocking system configuration in their application notes and datasheet. Engineers should follow these guidelines and consider factors like clock frequency, jitter, and skew to ensure optimal performance and stability.
  • Renesas provides EMC and EMI guidelines in their application notes and design resources. Engineers should follow these guidelines, use shielding, and implement proper grounding and decoupling techniques to minimize EMI and ensure EMC.
  • Renesas provides testing and validation guidelines in their application notes and datasheet. Engineers should follow these guidelines, use industry-standard testing tools and methodologies, and perform thorough validation to ensure the device meets the required specifications and standards.

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89HPES10T4G2ZBBCG Overview

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