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89HPES12T3G2ZBBCG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and two downstream ports or peer-to-peer switching between downstream ports.

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89HPES12T3G2ZBBCG - Renesas Electronics PCB footprint - BGA - BGA - bga 324
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89HPES12T3G2ZBBCG - Renesas Electronics  - 3D model - BGA - bga 324
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89HPES12T3G2ZBBCG Details

  • Manufacturer Part Number:

    89HPES12T3G2ZBBCG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    BGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    BCG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 100 MHZ

  • Bus Compatibility:

    PCI, SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    12000 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.72 mm

  • Supply Current-Max:

    781 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES12T3G2ZBBCG Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guidelines in their application notes and design resources. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Renesas recommends using their Power Management ICs (PMICs) specifically designed for the 89HPES12T3G2ZBBCG. These PMICs provide optimized power management and voltage regulation. Additionally, Renesas provides power management design guides and application notes.
  • While the datasheet provides the absolute maximum ratings, recommended operating conditions, and DC characteristics, it's essential to consult Renesas' application notes and design resources for more detailed information on operating conditions, tolerances, and derating guidelines.
  • Renesas provides EMC and EMI design guidelines and application notes. It's crucial to follow these guidelines and implement proper shielding, grounding, and layout techniques to ensure EMC and EMI compliance.
  • Renesas offers a range of development tools, software, and evaluation boards for the 89HPES12T3G2ZBBCG, including the Renesas Starter Kit, Renesas Compiler Package, and various evaluation boards. These resources can be found on the Renesas website.

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89HPES12T3G2ZBBCG Overview

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