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89HPES16T4ZHBCG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and three downstream ports or peer-to-peer switching between downstream ports.

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89HPES16T4ZHBCG - Renesas Electronics PCB footprint - BGA - BGA - ahg484
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89HPES16T4ZHBCG - Renesas Electronics  - 3D model - BGA - ahg484
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89HPES16T4ZHBCG Details

  • Manufacturer Part Number:

    89HPES16T4ZHBCG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    CABGA-484

  • Pin Count:

    484

  • Manufacturer Package Code:

    BCG484

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 100 MHZ

  • Bus Compatibility:

    PCI; SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    312.5 MBps

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.86 mm

  • Supply Current-Max:

    756 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES16T4ZHBCG Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for the 89HPES16T4ZHBCG, which includes recommendations for PCB layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance, power integrity, and thermal dissipation.
  • The 89HPES16T4ZHBCG requires a specific power sequencing and voltage regulation scheme. Renesas recommends using a dedicated power management IC (PMIC) or a custom power supply design that meets the device's power requirements. The datasheet provides guidelines for power sequencing and voltage regulation, but additional design considerations may be necessary.
  • The 89HPES16T4ZHBCG is rated for operation up to 125°C, but it's essential to consider thermal management and derating factors when operating in high-temperature environments. Renesas provides thermal models and simulation tools to help designers estimate junction temperatures and optimize their designs for high-temperature operation.
  • Renesas provides guidelines for EMC and EMI compliance in the datasheet and application notes. Designers should follow these guidelines and consider using shielding, filtering, and other EMC/EMI mitigation techniques to ensure compliance with relevant standards and regulations.
  • Renesas recommends following the testing and validation procedures outlined in the datasheet and application notes. This includes functional testing, parametric testing, and environmental testing to ensure the device meets the required specifications and operates reliably in the target application.

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89HPES16T4ZHBCG Overview

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Part Image 89HPES16T4ZHBC Integrated Device Technology Inc

PCI Bus Controller, CMOS, PBGA484