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89HPES24T6G2ZCALG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and five downstream ports or peer-to-peer switching between downstream ports.

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89HPES24T6G2ZCALG - Renesas Electronics PCB footprint - BGA - BGA - ALG324
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89HPES24T6G2ZCALG - Renesas Electronics  - 3D model - BGA - ALG324
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89HPES24T6G2ZCALG Details

  • Manufacturer Part Number:

    89HPES24T6G2ZCALG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    BGA-676

  • Pin Count:

    324

  • Manufacturer Package Code:

    ALG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES24T6G2ZCALG Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for PCB layout and thermal management in their application notes. It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • Renesas recommends using a power management IC (PMIC) specifically designed for the 89HPES24T6G2ZCALG. The PMIC should be able to provide the required voltage rails, power sequencing, and voltage regulation. Renesas provides guidance on power sequencing and voltage regulation in their application notes and design guides.
  • The recommended operating conditions are specified in the datasheet, but it's essential to consider factors like temperature, humidity, and power supply quality. Ensure reliable operation by following Renesas' guidelines for operating conditions, and implementing proper thermal management, power sequencing, and voltage regulation.
  • Renesas provides debugging tools and software, such as the Renesas Debug Tool, to help troubleshoot and debug issues. Additionally, consult the datasheet, application notes, and design guides for troubleshooting guidelines and common pitfalls to avoid.
  • Renesas offers various development boards and evaluation kits for the 89HPES24T6G2ZCALG, which provide a platform for evaluating and developing applications. These kits usually include documentation, software, and hardware resources to help get started with development.

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89HPES24T6G2ZCALG Overview

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