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89HPES3T3ZBBCGI8 - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and two downstream ports or peer-to-peer switching between downstream ports.

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89HPES3T3ZBBCGI8 - Renesas Electronics - PCB symbol
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PCB Footprints
89HPES3T3ZBBCGI8 - Renesas Electronics PCB footprint - BGA - BGA - 144-LEAD BGA [13 X 13]
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89HPES3T3ZBBCGI8 - Renesas Electronics - 3D model - BGA - 144-LEAD BGA [13 X 13]
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89HPES3T3ZBBCGI8 Details

  • Manufacturer Part Number:

    89HPES3T3ZBBCGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    CABGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    BCG144

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI; SMBUS

  • Clock Frequency-Max:

    100 MHz

  • Drive Interface Standard:

    IEEE 1149.1

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA144,12X12,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES3T3ZBBCGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends following the power sequencing guidelines outlined in the datasheet, which involves powering up the VCC and VCCIO pins in a specific order. Additionally, Renesas provides a power sequencing application note that provides more detailed information and examples.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1uF to 1uF, placed as close as possible to the power pins. The datasheet provides more detailed information on decoupling capacitor selection and placement.
  • Renesas provides a troubleshooting guide in their application note documents, which covers common issues and their solutions. Additionally, Renesas offers technical support through their website and support teams.
  • The 89HPES3T3ZBBCGI8 is rated for operation in the industrial temperature range (-40°C to 85°C) and is designed to meet various environmental standards, including RoHS and REACH. The datasheet provides more detailed information on operating conditions and environmental compliance.

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89HPES3T3ZBBCGI8 Overview

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