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89HPES4T4G2ZCALG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and three downstream ports or peer-to-peer switching between downstream ports.

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89HPES4T4G2ZCALG - Renesas Electronics PCB footprint - BGA - BGA - ALG324
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89HPES4T4G2ZCALG - Renesas Electronics  - 3D model - BGA - ALG324
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89HPES4T4G2ZCALG Details

  • Manufacturer Part Number:

    89HPES4T4G2ZCALG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    BGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    ALG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    100 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES4T4G2ZCALG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) document, which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or through direct consultation with Renesas support.
  • The recommended settings for the internal regulators can be found in the device's datasheet or user manual. Additionally, Renesas provides a configuration tool that can help with setting up the regulators for specific use cases.
  • Renesas provides a troubleshooting guide in their application note (APN) document, which covers common issues, such as power-on reset, clocking, and peripheral configuration. Additionally, Renesas support can be contacted for further assistance.
  • Renesas provides thermal design guidelines in their datasheet and application note (APN) document, including information on thermal resistance, junction temperature, and heat sink design.

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89HPES4T4G2ZCALG Overview

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