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89HPES4T4ZBBCGI8 - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and three downstream ports or peer-to-peer switching between downstream ports.

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89HPES4T4ZBBCGI8 - Renesas Electronics PCB footprint - BGA - BGA - 144-LEAD BGA [13 X 13]
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89HPES4T4ZBBCGI8 - Renesas Electronics  - 3D model - BGA - 144-LEAD BGA [13 X 13]
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89HPES4T4ZBBCGI8 Details

  • Manufacturer Part Number:

    89HPES4T4ZBBCGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    CABGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    BCG144

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI; SMBUS

  • Clock Frequency-Max:

    100 MHz

  • Drive Interface Standard:

    IEEE 1149.1

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA144,12X12,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES4T4ZBBCGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) document, which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application note, which provides a detailed power-up and power-down sequence.
  • The recommended settings for the internal voltage regulators can be found in the device's datasheet or user manual. Renesas provides guidelines for setting the voltage regulator outputs, including voltage levels, current limits, and stability considerations.
  • Renesas provides a troubleshooting guide in their application note or user manual, which includes common issues, error codes, and debugging techniques. Additionally, Renesas offers technical support and FAQs on their website.
  • Renesas provides thermal design guidelines in their application note, including thermal resistance values, junction-to-case thermal resistance, and recommended heat sink designs.

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89HPES4T4ZBBCGI8 Overview

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