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89HPES64H16ZABRI - Renesas Electronics

Description: Provides 64 PCIe lanes and 16 ports of high-performance, deterministic system interconnect switching. All ports receive full line rate, non-blocking throughput for multiple traffic flows regardless of switch loading.

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89HPES64H16ZABRI - Renesas Electronics PCB footprint - BGA - BGA - BLG1156
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89HPES64H16ZABRI - Renesas Electronics  - 3D model - BGA - BLG1156
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89HPES64H16ZABRI Details

  • Manufacturer Part Number:

    89HPES64H16ZABRI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-1156

  • Pin Count:

    1156

  • Manufacturer Package Code:

    BR1156

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    32000 MBps

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES64H16ZABRI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes, which provide detailed guidelines for power-up and power-down sequences.
  • The recommended settings for the internal voltage regulators can be found in the device's datasheet or user manual. Renesas provides guidelines for setting the voltage regulator outputs, including voltage levels, current limits, and stability considerations.
  • Renesas provides power-saving modes and techniques in the device's datasheet and user manual. These include dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, Renesas offers software development kits (SDKs) and tools to help optimize power consumption.
  • Renesas provides thermal design guidelines in their application notes, which include thermal resistance values, junction-to-case thermal resistance, and recommended thermal interface materials. Engineers should also consider thermal simulation tools and thermal analysis software to optimize their design.

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89HPES64H16ZABRI Overview

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